Device
Xiaomi AI Cube
Prototype compact AI computer combining three Xiaomi XRING chips to deploy and run large language models locally, including 3B and 120B parameter models.
Specifications
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Form factor Tabletop Processor Xiaomi XRING O3 (10-core CPU, 16-core G2-Ultra NX GPU, 200 TOPS NPU), Xiaomi XRING O100 AI accelerator, Xiaomi XRING D100 automotive AI processor (20-core CPU, 16-core NPU) Made in CN Release date Aug 24, 2026 AI features On-device AI Primary use cases Productivity Education Other
Additional information
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Three-chip collaborative computing, local 3B + 120B model deployment, fast/slow model switching, O100 up to 1.22 TB/s near-memory bandwidth and 28,672 effective data lines, O100 uses 6nm 3D wafer-level stacking, aerospace-grade aluminum unibody, 33,874 CNC-machined openings, up to 150W sustained power, engineering prototype with no confirmed retail production plan
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