Device
CS-3 AI Supercomputer
Wafer-scale AI supercomputer designed for training and inference of large AI models, capable of scaling up to 24 trillion parameter models on a single logica...
Specifications
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Form factor Other Processor Cerebras Wafer Scale Engine 3 (WSE-3) RAM 44GB of on-chip SRAM per wafer Made in US Release date Mar, 2024 AI features On-device AI Primary use cases Productivity Other
Additional information
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Up to 24 trillion parameter models on a single logical device; 900,000 AI-optimized cores; 214 Pb/s interconnect bandwidth; 44 GB on-chip SRAM; 21 PB/s memory bandwidth; 1.2 Tb/s system I/O; liquid-cooled engine block with redundant hot-swappable power and cooling; designed for AI training and inference with lower power consumption and smaller footprint than comparable GPU clusters.
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